91b40f613f
* Swapped in Choc V2 switches, updated routing and outline Removed redundant groundplane routing Created double sided chocV2 footprint based on the kbd repo * Updated readme. * Added images * Added images to Readme, fixed formatting * Added gerbers * Routing and edgecut cleanup, DRC error fixes * Fixed drill layer misalingment and regenerated Gerbers * Updated readme with pcb ordering instructions * Added branding and rebuilt gerbers * Moved Blackpill l closer to top edge to accomidate wide-lipped usb-c * Revised footprint for better Cherry MX 3-pin support Added teardrops Revised GND zone params to allow islands Removed unneeded island creating vias wiring tweaks * Adjusted footprint to include Gateron low profile, TTC low profile & cherry low-profile Rebuilt teardrops rebuilt ziones * Fixed LH traces after footprint rework * Updated readme * Fixed MUR340 Hybrid footprint Regenerated .dsn for autorouting * Swapped in 'kitckitchen sink' switch footprints Updated trrs jack poke-yoke Blackpill masking * Added jlcpcb order number silkscreen updated version numbering * Added speaker * Moved piezo knockout below blackpill * Modified Choc V2 3rd pin solder pads * Moved ChocV2 3rd pin, made hotswop pads larger * Updated choc v2 footprint to match kbd by foostan * Updated branding, readme, and fixed drc breaks THIS VERSION WAS SENT OUT FOR PRODUCTION * Added upcharge notes from test run * Added breakoff pinky cluster * Updated breakoff pinky to not cut into hotswop pads * Fixed broken keys with isolated ground planes Moved footprints into repo Connected some ground pins on switch footrpint Updated docs with broken key notes * Updated switch footrpints * Footprint tweaks * Added updated pic for v1.4 * Fixed choc 2nd min misalingment Revised 'everything' footprint: combined red-dragon and MX hole removed organic masks in leiu of exotic annular rings fixed malformed edge shapes * Updated docs and fixed footprint mask * Footprint cleanup reverted branding to older MX specific style * Fixed trrs footprint added key numbering cleaned up wiring between blackpill holes * Removed speaker * Sent this version out for production test (v1.5) * Updated readme notes * Added tentin puck * Trace cleanup * Updated trrs silks, bumped font size * Consolidated cantor mx only footprints Removed masterkey footprint library Removed text from tenting puck footprint * v1.5 tested successfuly * Checkpoint commit * Cleanup for PR * Added gerber zip and Notes * Updated honey-do * Ignore cantore mx backup subdirectory * Ignore Cantor MX backup subdirectory * Exclude Cantor Classic KiCad backups from git * Corner radius doubled next to TRRS jack * Removed pinky snap-off ditch nubs * Break-out point thickness increased Thicker breakout points allowed for removal of GND traces on pinky column Regenerated teardrops and planes * Rounded corners using plugin Fixed tiny-chunk traces that were preventing corner rounding Regenerated tear drops Regenerated zones Updated versioning from 1.51 to 1.6 * Fixed malformed rounded corner trace Regenerated Gerbers Updated branding URL * Udated trace connection for switch 11 * Revised branding/attribution * Fixed rounded trace corner under MCU * Regenerated Gerbers Removed small ground zone island Added vias to connect large GND zone islands Fixed unrounded traces Udated branding and attribution * Pulled in changes from main, reverted readme * Removed duplicate GND zone on front Removed unused GND zone front/back vias Fixed malformed trace on pin 4 * Moved front traces under MCU to back Minor trace cleanup * Dialed in teardrops Moved most horizontal traces under MCU to back Backside silk logo tweak Updated drawing sheets attributions and versions Regenerated Gerbers * Fixed gerber mystery trace bug Ran 'Cleanup track and vias' and it wiped out the mystery trace Also reset origin points regenrated Gerbers & zips * Added note to BOM about tenting pucks fixed readme spelling error removed Cantor MX backups
128 lines
2.6 KiB
Plaintext
128 lines
2.6 KiB
Plaintext
{
|
|
"Header": {
|
|
"GenerationSoftware": {
|
|
"Vendor": "KiCad",
|
|
"Application": "Pcbnew",
|
|
"Version": "7.0.5-0"
|
|
},
|
|
"CreationDate": "2023-10-24T16:12:26-07:00"
|
|
},
|
|
"GeneralSpecs": {
|
|
"ProjectId": {
|
|
"Name": "Cantor_MX",
|
|
"GUID": "43616e74-6f72-45f4-9d58-2e6b69636164",
|
|
"Revision": "rev1.6"
|
|
},
|
|
"Size": {
|
|
"X": 142.9566,
|
|
"Y": 98.657
|
|
},
|
|
"LayerNumber": 2,
|
|
"BoardThickness": 1.6,
|
|
"Finish": "None"
|
|
},
|
|
"DesignRules": [
|
|
{
|
|
"Layers": "Outer",
|
|
"PadToPad": 0.0,
|
|
"PadToTrack": 0.0,
|
|
"TrackToTrack": 0.2,
|
|
"MinLineWidth": 0.25,
|
|
"TrackToRegion": 0.2,
|
|
"RegionToRegion": 0.2
|
|
}
|
|
],
|
|
"FilesAttributes": [
|
|
{
|
|
"Path": "Cantor_MX-F_Cu.gtl",
|
|
"FileFunction": "Copper,L1,Top",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "Cantor_MX-B_Cu.gbl",
|
|
"FileFunction": "Copper,L2,Bot",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "Cantor_MX-F_Paste.gtp",
|
|
"FileFunction": "SolderPaste,Top",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "Cantor_MX-B_Paste.gbp",
|
|
"FileFunction": "SolderPaste,Bot",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "Cantor_MX-F_Silkscreen.gto",
|
|
"FileFunction": "Legend,Top",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "Cantor_MX-B_Silkscreen.gbo",
|
|
"FileFunction": "Legend,Bot",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "Cantor_MX-F_Mask.gts",
|
|
"FileFunction": "SolderMask,Top",
|
|
"FilePolarity": "Negative"
|
|
},
|
|
{
|
|
"Path": "Cantor_MX-B_Mask.gbs",
|
|
"FileFunction": "SolderMask,Bot",
|
|
"FilePolarity": "Negative"
|
|
},
|
|
{
|
|
"Path": "Cantor_MX-Edge_Cuts.gm1",
|
|
"FileFunction": "Profile",
|
|
"FilePolarity": "Positive"
|
|
}
|
|
],
|
|
"MaterialStackup": [
|
|
{
|
|
"Type": "Legend",
|
|
"Name": "Top Silk Screen"
|
|
},
|
|
{
|
|
"Type": "SolderPaste",
|
|
"Name": "Top Solder Paste"
|
|
},
|
|
{
|
|
"Type": "SolderMask",
|
|
"Thickness": 0.01,
|
|
"Name": "Top Solder Mask"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.035,
|
|
"Name": "F.Cu"
|
|
},
|
|
{
|
|
"Type": "Dielectric",
|
|
"Thickness": 1.51,
|
|
"Material": "FR4",
|
|
"Name": "F.Cu/B.Cu",
|
|
"Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.035,
|
|
"Name": "B.Cu"
|
|
},
|
|
{
|
|
"Type": "SolderMask",
|
|
"Thickness": 0.01,
|
|
"Name": "Bottom Solder Mask"
|
|
},
|
|
{
|
|
"Type": "SolderPaste",
|
|
"Name": "Bottom Solder Paste"
|
|
},
|
|
{
|
|
"Type": "Legend",
|
|
"Name": "Bottom Silk Screen"
|
|
}
|
|
]
|
|
}
|