91b40f613f
* Swapped in Choc V2 switches, updated routing and outline Removed redundant groundplane routing Created double sided chocV2 footprint based on the kbd repo * Updated readme. * Added images * Added images to Readme, fixed formatting * Added gerbers * Routing and edgecut cleanup, DRC error fixes * Fixed drill layer misalingment and regenerated Gerbers * Updated readme with pcb ordering instructions * Added branding and rebuilt gerbers * Moved Blackpill l closer to top edge to accomidate wide-lipped usb-c * Revised footprint for better Cherry MX 3-pin support Added teardrops Revised GND zone params to allow islands Removed unneeded island creating vias wiring tweaks * Adjusted footprint to include Gateron low profile, TTC low profile & cherry low-profile Rebuilt teardrops rebuilt ziones * Fixed LH traces after footprint rework * Updated readme * Fixed MUR340 Hybrid footprint Regenerated .dsn for autorouting * Swapped in 'kitckitchen sink' switch footprints Updated trrs jack poke-yoke Blackpill masking * Added jlcpcb order number silkscreen updated version numbering * Added speaker * Moved piezo knockout below blackpill * Modified Choc V2 3rd pin solder pads * Moved ChocV2 3rd pin, made hotswop pads larger * Updated choc v2 footprint to match kbd by foostan * Updated branding, readme, and fixed drc breaks THIS VERSION WAS SENT OUT FOR PRODUCTION * Added upcharge notes from test run * Added breakoff pinky cluster * Updated breakoff pinky to not cut into hotswop pads * Fixed broken keys with isolated ground planes Moved footprints into repo Connected some ground pins on switch footrpint Updated docs with broken key notes * Updated switch footrpints * Footprint tweaks * Added updated pic for v1.4 * Fixed choc 2nd min misalingment Revised 'everything' footprint: combined red-dragon and MX hole removed organic masks in leiu of exotic annular rings fixed malformed edge shapes * Updated docs and fixed footprint mask * Footprint cleanup reverted branding to older MX specific style * Fixed trrs footprint added key numbering cleaned up wiring between blackpill holes * Removed speaker * Sent this version out for production test (v1.5) * Updated readme notes * Added tentin puck * Trace cleanup * Updated trrs silks, bumped font size * Consolidated cantor mx only footprints Removed masterkey footprint library Removed text from tenting puck footprint * v1.5 tested successfuly * Checkpoint commit * Cleanup for PR * Added gerber zip and Notes * Updated honey-do * Ignore cantore mx backup subdirectory * Ignore Cantor MX backup subdirectory * Exclude Cantor Classic KiCad backups from git * Corner radius doubled next to TRRS jack * Removed pinky snap-off ditch nubs * Break-out point thickness increased Thicker breakout points allowed for removal of GND traces on pinky column Regenerated teardrops and planes * Rounded corners using plugin Fixed tiny-chunk traces that were preventing corner rounding Regenerated tear drops Regenerated zones Updated versioning from 1.51 to 1.6 * Fixed malformed rounded corner trace Regenerated Gerbers Updated branding URL * Udated trace connection for switch 11 * Revised branding/attribution * Fixed rounded trace corner under MCU * Regenerated Gerbers Removed small ground zone island Added vias to connect large GND zone islands Fixed unrounded traces Udated branding and attribution * Pulled in changes from main, reverted readme * Removed duplicate GND zone on front Removed unused GND zone front/back vias Fixed malformed trace on pin 4 * Moved front traces under MCU to back Minor trace cleanup * Dialed in teardrops Moved most horizontal traces under MCU to back Backside silk logo tweak Updated drawing sheets attributions and versions Regenerated Gerbers * Fixed gerber mystery trace bug Ran 'Cleanup track and vias' and it wiped out the mystery trace Also reset origin points regenrated Gerbers & zips * Added note to BOM about tenting pucks fixed readme spelling error removed Cantor MX backups
54 lines
3.3 KiB
Plaintext
54 lines
3.3 KiB
Plaintext
(module SolderJumperPair (layer F.Cu) (tedit 59286549)
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(solder_mask_margin 0.001)
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(solder_paste_margin -0.02)
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(clearance 0.001)
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(fp_text reference REF** (at -0.508 1.016) (layer Cmts.User) hide
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(effects (font (size 0.3 0.3) (thickness 0.03)))
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)
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(fp_text value solder_jumper (at 0 -3.524) (layer F.SilkS) hide
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(effects (font (size 0.4 0.4) (thickness 0.04)))
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)
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(fp_text user Right (at 3 1.5) (layer B.SilkS)
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(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
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)
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(fp_text user Right (at 3 1.5) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text user Left (at 3 -1.5) (layer B.SilkS)
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(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
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)
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(fp_text user Left (at 3 -1.5) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_poly (pts (xy 0.75 1.4) (xy 0.7048 1.1435) (xy 0.5745 0.9179) (xy 0.375 0.7505)
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(xy 0.1302 0.6614) (xy -0.1302 0.6614) (xy -0.375 0.7505) (xy -0.5745 0.9179)
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(xy -0.7048 1.1435) (xy -0.75 1.4) (xy 0.75 1.4)) (layer F.Cu) (width 0.01))
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(fp_poly (pts (xy -0.75 1.6) (xy -0.7048 1.8565) (xy -0.5745 2.0821) (xy -0.375 2.2495)
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(xy -0.1302 2.3386) (xy 0.1302 2.3386) (xy 0.375 2.2495) (xy 0.5745 2.0821)
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(xy 0.7048 1.8565) (xy 0.75 1.6) (xy -0.75 1.6)) (layer F.Cu) (width 0.01))
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(fp_poly (pts (xy 0.75 -1.6) (xy 0.7048 -1.8565) (xy 0.5745 -2.0821) (xy 0.375 -2.2495)
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(xy 0.1302 -2.3386) (xy -0.1302 -2.3386) (xy -0.375 -2.2495) (xy -0.5745 -2.0821)
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(xy -0.7048 -1.8565) (xy -0.75 -1.6) (xy 0.75 -1.6)) (layer F.Cu) (width 0.01))
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(fp_poly (pts (xy -0.75 -1.4) (xy -0.7048 -1.1435) (xy -0.5745 -0.9179) (xy -0.375 -0.7505)
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(xy -0.1302 -0.6614) (xy 0.1302 -0.6614) (xy 0.375 -0.7505) (xy 0.5745 -0.9179)
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(xy 0.7048 -1.1435) (xy 0.75 -1.4) (xy -0.75 -1.4)) (layer F.Cu) (width 0.01))
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(fp_poly (pts (xy 0.75 1.4) (xy 0.7048 1.1435) (xy 0.5745 0.9179) (xy 0.375 0.7505)
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(xy 0.1302 0.6614) (xy -0.1302 0.6614) (xy -0.375 0.7505) (xy -0.5745 0.9179)
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(xy -0.7048 1.1435) (xy -0.75 1.4) (xy 0.75 1.4)) (layer B.Cu) (width 0.01))
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(fp_poly (pts (xy -0.75 1.6) (xy -0.7048 1.8565) (xy -0.5745 2.0821) (xy -0.375 2.2495)
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(xy -0.1302 2.3386) (xy 0.1302 2.3386) (xy 0.375 2.2495) (xy 0.5745 2.0821)
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(xy 0.7048 1.8565) (xy 0.75 1.6) (xy -0.75 1.6)) (layer B.Cu) (width 0.01))
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(fp_poly (pts (xy 0.75 -1.6) (xy 0.7048 -1.8565) (xy 0.5745 -2.0821) (xy 0.375 -2.2495)
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(xy 0.1302 -2.3386) (xy -0.1302 -2.3386) (xy -0.375 -2.2495) (xy -0.5745 -2.0821)
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(xy -0.7048 -1.8565) (xy -0.75 -1.6) (xy 0.75 -1.6)) (layer B.Cu) (width 0.01))
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(fp_poly (pts (xy -0.75 -1.4) (xy -0.7048 -1.1435) (xy -0.5745 -0.9179) (xy -0.375 -0.7505)
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(xy -0.1302 -0.6614) (xy 0.1302 -0.6614) (xy 0.375 -0.7505) (xy 0.5745 -0.9179)
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(xy 0.7048 -1.1435) (xy 0.75 -1.4) (xy -0.75 -1.4)) (layer B.Cu) (width 0.01))
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(pad "" smd circle (at 0 -1.5) (size 2 2) (layers *.Mask))
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(pad "" smd circle (at 0 1.5) (size 2 2) (layers *.Mask))
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(pad 3 thru_hole circle (at 0 1.95) (size 0.4 0.4) (drill 0.3) (layers *.Cu *.Mask))
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(pad 2 thru_hole circle (at 0 1.05) (size 0.4 0.4) (drill 0.3) (layers *.Cu *.Mask))
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(pad 1 thru_hole circle (at 0 -1.95) (size 0.4 0.4) (drill 0.3) (layers *.Cu *.Mask))
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(pad 2 thru_hole circle (at 0 -1.05) (size 0.4 0.4) (drill 0.3) (layers *.Cu *.Mask))
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)
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